Overview
Infineon BSP613PL6327 is an RF IC used for RF signal amplification and front-end conditioning. Used in wireless modules and communication front ends. Mounting Type: Surface Mount.
Core specification
Part numberBSP613PL6327
ManufacturerInfineon
Series / designationInterface ICs
CategoryActive Components
SubcategoryInterface ICs
AvailabilityRemote Stock: 361,512 pcs
Lead timeLead time from 1 week
Technical parameters
Mounting Type
Surface Mount
Series
Interface ICs