Overview
Texas Instruments LM317D-PACK is an RF IC for RF signal amplification and front-end conditioning. Typical in telemetry and communication hardware. Mounting Type: Surface Mount.
Core specification
Part numberLM317D-PACK
ManufacturerTexas Instruments
Series / designationInterface ICs
CategoryActive Components
SubcategoryInterface ICs
AvailabilityRemote Stock: 205,381 pcs
Lead timeLead time from 1 week
Technical parameters
Mounting Type
Surface Mount
Series
Interface ICs